HiSilicon

HiSilicon () is a Chinese fabless semiconductor company based in Shenzhen, Guangdong province and wholly owned by Huawei. HiSilicon purchases licenses for CPU designs from ARM Holdings, including the ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore,HiSilicon Licenses ARM Technology for use in Innovative 3G/4G Base Station, Networking Infrastructure and Mobile Computing Applications , 2 August 2011 on ARM.com ARM Cortex-A53, ARM Cortex-A57 and also for their Mali graphics cores.ARM Launches Cortex-A50 Series, the World's Most Energy-Efficient 64-bit Processors on ARM.com HiSilicon has also purchased licenses from Vivante Corporation for their GC4000 graphics core.

HiSilicon is reputed to be the largest domestic designer of integrated circuits in China. In 2020, the United States instituted rules that require any American firms providing equipment to HiSilicon or non-American firms who use American technologies or IPR (such as TSMC) that supply HiSilicon to have licenses as part of the ongoing trade dispute, and Huawei announced it will stop producing its Kirin chipsets from 15 September 2020 onwards due to this disruption of its supply chain. On 29 August 2023, Huawei announced the first fully domestically fabricated chip, the Kirin 9000S, which Huawei went on to use on the Mate 60 Pro phablet series of phones and MatePad 13.2 tablets.

History HiSilicon was Huawei's ASIC design center, which was founded in 1991.

2004– Shenzhen HiSilicon Semiconductor Co., Ltd. was registered and the company was formally established. 2016– HiSilicon's Kirin 960 chipset was rated one of the "best of Android 2016" in performance by Android Authority. 2019– Shanghai HiSilicon, a wholly owned subsidiary of Huawei, was established. 2025– First HiSilicon 7nm N+2 Kirin X90 series PC class in-house ARM-powered chips launched for MateBook Pro, MateBook Fold and MatePad Edge HarmonyOS powered computers following Intel and Qualcomm chip May 2024 bans. 2026–HiSilicon's first in-house CMOS camera series, CS520V200 50 megapixel camera with 4K 50FPS and 1080p 120FPS support with Hi3519DV500 4K30 AI ISP camera chip.

Smartphone application processors

HiSilicon develops SoCs based on the ARM architecture. Though not exclusive, these SoCs see preliminary use in handheld and tablet devices of its parent company Huawei.

K3V2 The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphonesbrightsideofnews.com: Huawei U9510 Ascend D Quad XL Benchmarked on ARMdevices.net and Huawei MediaPad 10 FHD7 tablets. This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU.Hands On with the Huawei Ascend W1, Ascend D2, and Ascend Mate on Anandtech The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Performance (GFLOPS) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN K3V2 (Hi3620) 40 nm ARMv7 Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB 4 1.4 Vivante GC4000 240 15.3 LPDDR2 64-bit (2x32-bit Dual-channel) 8.5(533 MHz) Q1 2012

K3V2E This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Performance (GFLOPS) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN K3V2E (Hi3620) 40 nm ARMv7 Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB 4 1.5 Vivante GC4000 240 15.3 LPDDR2 64-bit (2x32-bit Dual-channel) 8.5(533 MHz) 2013

Kirin 620 • supports – USB 2.0 / 13 MP / 1080p video encode

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Performance (GFLOPS) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN Kirin 620 (Hi6220) 28 nm ARMv8-A Cortex-A53 8 1.2 Mali-450 MP4 500 32 LPDDR3 32-bit (1x32-bit Single-channel) 6.4(800 MHz) Dual SIM LTE Cat.4 (150 Mbit/s) Q1 2015

Kirin 650, 655, 658, 659 Model number Fab CPU GPU Memory technology Nav Wireless Sampling availability Devices using ISA μarch Cores Freq (GHz) μarch Freq (MHz) Performance (GFLOPS) Type Buswidth(bit) Bandwidth (GB/s) Cellular WLAN PAN Kirin 650 (Hi6250) 16 nm FinFET+ ARM v8-A Cortex-A53Cortex-A53 4+4 2.0 (4x A53) 1.7 (4x A53) Mali-T830 MP2 900 57.6 LPDDR3 64-bit (2x32-bit Dual-channel) 14.9(933 MHz) A-GPS, Glonass Dual SIM LTE Cat.6 (300 Mbit/s) WIFI 4 (802.11n) Bluetooth 4.1 Q2 2016 Kirin 655 2.12 (4x A53) 1.7 (4x A53) Q4 2016 Kirin 658 2.35 (4x A53) 1.7 (4x A53) WIFI 5 (802.11ac) Q2 2017

Kirin 710 Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Performance (GFLOPS) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN Kirin 710 (Hi6260) TSMC 12 nm FinFET ARMv8-A Cortex-A73Cortex-A53 4+4 2.2 (A73)1.7 (A53) Mali-G51 MP4 1000 64 LPDDR3LPDDR4 32-bit A-GPS, GLONASS Dual SIM LTE Cat.12 (600 Mbit/s) WIFI 4 (802.11 b/g/n) Bluetooth v4.2 Q3 2018 Kirin 710F Q4 2019Kirin 710ASMIC 14 nm FinFET2.0 (A73)1.7 (A53) Q2 2020

Kirin 810 and 820

DaVinci NPU based on Tensor Arithmetic Unit Kirin 820 supported 5G NSA & SA

Model numberFabCPUGPU Memory technologyNav Wireless Sampling availability Devices usingISAμarch Cores Freq (GHz)μarch Freq (MHz) Performance (GFLOPS) Type Bus width (bit)Bandwidth (GB/s)CellularWLANPAN Kirin 810 (Hi6280) 7 nm FinFETARM v8.2-ACortex-A76 Cortex-A55 (big.LITTLE) 2+6 2.27 (2x A76)1.90 (6x A55) Mali-G52 MP6 820 157.4LPDDR4X64-bit (4x16-bit Quad-channel) 34.1(2133 MHz) A-GPS, Glonass, BDS Dual SIM LTE Cat.12 (600 Mbit/s) WIFI 5 (802.11ac) Bluetooth 5.0 Q2 2019 Kirin 820 5G (Hi6290L V100) (1+3)+4 2.36 (1x A76 H)2.22 (3x A76 L)1.84 (4x A55) Mali-G57 MP6 Balong 5000 (Sub-6 GHz Only; NSA & SA) Q1 2020 Kirin 820E 5G 3+3 2.22 (3x A76 L)1.84 (3x A55) Mali-G57 MP6 Balong 5000 (Sub-6 GHz Only; NSA & SA) Q1 2021

Kirin 910 and 910T Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Performance (GFLOPS) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN Kirin 910 (Hi6620) 28 nm HPM ARMv7 Cortex-A9 4 1.6 Mali-450 MP4 533 32 LPDDR3 32-bit (1x32-bit Single-channel) 6.4(800 MHz) LTE Cat.4 H1 2014 Kirin 910T 1.8 700 41.8 H1 2014

Kirin 920, 925 and 928 • The Kirin 920 SoC also contains an image processor that supports up to 32-megapixel

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Performance (GFLOPS) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN Kirin 920 28 nm HPM ARMv7 Cortex-A15Cortex-A7 big.LITTLE 4+4 1.7 (A15)1.3 (A7) Mali-T628 MP4 600 76.8 LPDDR3 64-bit (2x32-bit Dual-channel) 12.8(800 MHz) LTE Cat.6 (300 Mbit/s) H2 2014 Kirin 925 (Hi3630) 1.8 (A15)1.3 (A7) Q3 2014 Kirin 9282.0 (A15)1.3 (A7)

Kirin 930 and 935 • supports – SD 3.0 (UHS-I) / eMMC 4.51 / Dual-band a/b/g/n Wi-Fi / Bluetooth 4.0 Low Energy / USB 2.0 / 32 MP ISP / 1080p video encode

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Performance (GFLOPS) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN Kirin 930 (Hi3635) 28 nm HPC ARMv8-A Cortex-A53Cortex-A53 4+4 2.0 (A53)1.5 (A53) Mali-T628 MP4 600 76.8 LPDDR3 64-bit (2x32-bit Dual-channel) 12.8(800 MHz) Dual SIM LTE Cat.6 (DL:300 Mbit/s UP:50 Mbit/s) Q1 2015 Kirin 935 2.2 (A53)1.5 (A53) 680 87 Q1 2015

Kirin 950 and 955 • supports – SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Native 10-bit 4K video encode / i5 coprocessor / Tensilica HiFi 4 DSP Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Performance (GFLOPS) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN Kirin 950 (Hi3650) TSMC 16 nm FinFET+ ARMv8-A Cortex-A72Cortex-A53 big.LITTLE 4+4 2.3 (A72)1.8 (A53) Mali-T880 MP4 900 151.2 LPDDR4 64-bit (2x32-bit Dual-channel) 25.6(1600 MHz) Dual SIM LTE Cat.6 Q4 2015 Kirin 955 2.5 (A72)1.8 (A53) LPDDR3 (3 GB)LPDDR4 (4 GB) Q2 2016

Kirin 960

Interconnect: ARM CCI-550, Storage: UFS 2.1, eMMC 5.1, Sensor Hub: i6

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Performance (GFLOPS) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN Kirin 960 (Hi3660) TSMC 16 nm FFC ARMv8-A Cortex-A73 Cortex-A53 big.LITTLE 4+4 2.36 (A73)1.84 (A53) Mali-G71 MP8 1037 199.1 LPDDR4 64-bit (2x32-bit Dual-channel) 25.6(1600 MHz) Dual SIM LTE Cat.12 LTE 4x CA, 4x4 MIMO Q4 2016

Kirin 970

Interconnect: ARM CCI-550, Storage: UFS 2.1, Sensor Hub: i7 Cadence Tensilica Vision P6 DSP. NPU made in collaboration with Cambricon Technologies. 1.92T FP16 OPS.

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Performance (GFLOPS) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN Kirin 970 (Hi3670) TSMC 10 nm FinFET+ ARMv8-A Cortex-A73 Cortex-A53 big.LITTLE 4+4 2.36 (A73)1.84 (A53) Mali-G72 MP12 746 214.8 LPDDR4X 64-bit (4x16-bit Quad-channel) 29.8(1866 MHz) Galileo Dual SIM LTE Cat.18 LTE 5x CA, No 4x4 MIMO Q4 2017

Kirin 980 and Kirin 985 5G/4G Kirin 980 is HiSilicon's first SoC based on 7 nm FinFET technology.

Interconnect: ARM Mali G76-MP10, Storage: UFS 2.1, Sensor Hub: i8 Dual NPU made in collaboration with Cambricon Technologies.

Kirin 985 5G is the second Hisilicon's 5G SoC based on 7 nm FinFET Technology. Interconnect: ARM Mali-G77 MP8, Storage UFS 3.0 Big-Tiny Da Vinci NPU: 1x Da Vinci Lite + 1x Da Vinci Tiny

Model number Fab CPU GPU Memory technology Nav Wireless Sampling availability Devices using ISA μarch Cores Freq (GHz) μarch Freq (MHz) Performance (GFLOPS) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN Kirin 980 TSMC 7 nm FinFET ARMv8.2-A Cortex-A76 Cortex-A55 (big.LITTLE) (2+2)+4 2.6 (A76 H)1.92 (A76 L)1.8 (A55) Mali-G76 MP10 720 345.6 LPDDR4X 64-bit (4x16-bit Quad-channel) 34.1(2133 MHz) Galileo Dual SIM LTE Cat.21 LTE 5x CA, No 4x4 MIMO Q4 2018 Kirin 985 5G/4G (Hi6290V110)(1+3)+42.58 (A76 H)2.40 (A76 L)1.84 (A55)Mali-G77 MP8 700 358.4Balong 5000 (Sub-6 GHz only; NSA & SA), 4G version availableQ2 2020

Kirin 990 4G, Kirin 990 5G and Kirin 990E 5G Kirin 990 5G is HiSilicon's first 5G SoC based on N7 nm+ FinFET technology.

Interconnect Kirin 990 4G: ARM Mali-G76 MP16 Kirin 990 5G: ARM Mali-G76 MP16 Kirin 990E 5G: ARM Mali-G76 MP14 Da Vinci NPU. Kirin 990 4G: 1x Da Vinci Lite + 1x Da Vinci Tiny Kirin 990 5G: 2x Da Vinci Lite + 1x Da Vinci Tiny Kirin 990E 5G: 1x Da Vinci Lite + 1x Da Vinci Tiny Da Vinci Lite features 3D Cube Tensor Computing Engine (2048 FP16 MACs + 4096 INT8 MACs), Vector unit (1024bit INT8/FP16/FP32) Da Vinci Tiny features 3D Cube Tensor Computing Engine (256 FP16 MACs + 512 INT8 MACs), Vector unit (256bit INT8/FP16/FP32)